Curing Results of the Jingyihuang FPC Flexible Circuit Board High-Temperature Oven

The Jingyihuang FPC Flexible Circuit Board High-Temperature Oven ensures uniform curing of PI substrates through precise temperature control technology (±1°C). Its multi-layer hot-air circulation system eliminates baking dead zones, and when combined with nitrogen protection, reduces the risk of oxidation by 80%.

The oven’s rapid heating design (reaching 300°C within 5 minutes) significantly boosts production efficiency, shortening the baking cycle by 40% compared to traditional methods. Additionally, the intelligent PLC system supports the storage of 20 sets of process parameters, meeting the step-heating requirements for materials of varying thicknesses.

The unique air pressure balancing structure of Jingyihuang’s FPC high-temperature oven prevents deformation of FPCs at high temperatures, with measured warpage ≤0.15 mm. Energy-efficient heating modules reduce energy consumption by 30%, and the oven complies with ROHS standards when paired with an exhaust gas treatment system.

Jingyihuang’s high-temperature ovens feature a fully stainless steel interior with strong corrosion resistance. Equipped with dual-channel temperature sensors, they provide real-time deviation alerts to ensure batch consistency. The modular design facilitates expansion, with a maximum single-batch capacity of 150 panels (400mm × 500mm), making them suitable for reliability testing in demanding applications such as high-frequency and automotive electronics.